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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019
Zoom product LOGO_TC35678FSG-002




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With Generation 2 Bluetooth Low Energy devices, Toshiba offers a family of single chip Bluetooth Low Energy V4.2 SoC with class-leading low power consumption and fully integrated and certified Bluetooth stack. Delivering long operating times, offering various security features and enabling a very small footprint design makes these devices suitable for battery driven applications in the wearable, healthcare, smartphone accessory, lighting, remote control, sensors and beacon markets.

The TC35678FSG-002 supports the following key features:

1. Full BLE 4.2 Support including:

- Central and peripheral modes

- Up to 8 simultaneous remote slaves, up to 2 remote masters

- Extended packet length support (251 bytes)

2. A High Integration Level:

- ARM CortexTM M0 MCU core

- Embedded Flash Memory (up to 256KB)

- Integrated DCDC and LDO

- 1.6 to 3.6 Voltage supply

- Integrated RF: LNA, balun, switch, matching circuit (for 50 Ω)

- -93.5 dBm RX sensitivity

- Up to 0 dBm TX output - adjustable

- I/F circuit for external power amplifier

 3. Ultra Low Power

- 3.3mA peak for Tx/Rx @ 0dBm, 50nA deep sleep mode

 4. High Security

- AEC-128bit data encryption/ECDH secure connection

- Privacy & LE Privacy

- True random number generation

- Flash content protection (by password)

- SWD (Single Wire Debug) switch off

- Unique 128bit chip ID

5. Industrial & Automotive Grade

- Industrial grade -40°C to 85°C

- Automotive grade products up to 105°C



Toshiba Automotive UFS

LOGO_Toshiba Automotive UFS

Toshiba BG3

LOGO_Toshiba BG3



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