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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019
Zoom product LOGO_Toshiba BG3

Toshiba BG3

LOGO_Toshiba BG3

Toshiba BG3

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The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.

BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.

The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.

TC35678FSG-002

LOGO_TC35678FSG-002

TC78B015AFTG

LOGO_TC78B015AFTG

Toshiba Automotive UFS

LOGO_Toshiba Automotive UFS

TZ1200

LOGO_TZ1200
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