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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019
Zoom product LOGO_Modern Packaging Solutions für innovative IPs

Modern Packaging Solutions für innovative IPs

LOGO_Modern Packaging Solutions für innovative IPs

Modern Packaging Solutions für innovative IPs

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With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. Through novel integration concepts – such as chip stacking or the use of interposers – it is possible to achieve higher data throughput while simultaneously lowering energy consumption and reducing space requirements. Modern packaging solutions also enable the integration of diverse component types, such as processors, sensors and wireless interfaces, in a single module. This is the only way to meet the increasing system requirements in industries like telecommunications, aerospace and medical technologies.

Particular challenges in the design process include mastering complexity, optimal utilization of the additional degrees of freedom and consideration of the close thermal, mechanical and electrical coupling in the stacked system. Fraunhofer IIS/EAS can assist you in solving these challenges for an optimized system packaging.

Our Services:

We accompany and support you in your modern packaging technology projects from the conception to the prototype. We offer you:

  • Consulting on currently available solutions for high levels of integration
  • Conducting of preliminary studies to assess system performance and costs
  • Selection of the best integration technology (e.g. interposers based on Fraunhofer technology) according to customer requirements and application conditions
  • Support from the design to prototype manufacturing and all the way to series production
  • Simulation of thermal, electrical and mechanical effects for complex packages
  • Assembly Design Kit (ADK) for verification to ensure that a package meets manufacturability and performance requirements
  • Design of high frequency systems up to 110Ghz from the chip to the packages (also with integrated antennas
  • Planning and organizing the prototype production at our partners

Your Added Value:

Our years of experience in system integration as well as our extensive network make us a valuable partner in the customer-specific design of integration solutions.

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems, such as sensor systems
  • Cost savings compared with comparable ASIC implementation, in particular for small quantities
  • Manufacturer-independent evaluation of available integration solutions
  • Reduced risk in the introduction of new packaging solutions
  • On-time implementation of prototypes and small series
  • Central point of contact from conception to design and prototype manufacturing

Ensiro

LOGO_Ensiro

AMS IC-Design with Intelligent IP

LOGO_AMS IC-Design with Intelligent IP

awiloc® - Positioning on IoT-devices

LOGO_awiloc® - Positioning on IoT-devices

Energy Harvesting for the Internet of Things

LOGO_Energy Harvesting for the Internet of Things

16 Gbit/s Physical Layer

LOGO_16 Gbit/s Physical Layer

IC-Design

LOGO_IC-Design

Ultra-low-power Technology RFicient® for the Internet of Things

LOGO_Ultra-low-power Technology RFicient® for the Internet of Things

Modern Packaging Solutions für innovative IPs is assigned to following product groups:

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