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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019
Zoom product LOGO_OSD335x C-SiP

OSD335x C-SiP

LOGO_OSD335x C-SiP

OSD335x C-SiP

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he OSD335x Complete System-in-Package (C-SiP™) integrates everything that is needed to build an embedded processing system into a single package.  It includes the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, 4KB of EEPROM, Embedded Multimedia Card (eMMC) non-volatile storage, a MEMS Oscillator, and all the needed passives into a single BGA package.  At 27mm X 27mm, it is almost 50% smaller than an equivalent system made of discrete components.

The OSD335x C-SiP™ significantly reduces the effort required to design an embedded system.  Don’t worry about DDR, Power Sequencing, Flash, or Oscillators, just connect power and your peripherals to the OSD335x C-SiP.  That’s It.

The OSD335x C-SiP also simplifies your sourcing and supply chain.  Over 100 components are integrated into one meaning you don’t have to find sources for DDR, eMMC, or capacitors.  We take care of that for you.

The OSD335x C-SiP is the perfect solution for the designer that is looking for the fastest way to complete their ARM Cortex®-A based system.

Features:

• Integrated into a single BGA Package:

    o Texas Instruments Sitara™ AM335x ARM® Cortex®-A8 Processor

    o up to 1GB DDR3L Memory

    o TPS65217C Power Management IC

    o TL5209 LDO

    o 4KB EEPROM

    o Up to 16GB eMMC Non-Volatile Storage

    o Low Power, Low Jitter MEMS Oscillator

    o Passives

• TI AM335x Features:

    o up to 1GHz

    o 8 Channel 12-bit SAR ADC

    o Ethernet 10/100/1000 x2

    o USB 2.0 HS OTG + PHY x2

    o MMC, SD and SDIO x3

    o LCD Controller

    o SGX 3D Graphics Engine

    o PRU Subsystem

• Access to all AM335x Peripherals

    o CAN, SPI, UART, I2C, GPIO, etc.

• Support for Industrial Protocols

    o EtherNet/IP, SERCOS III

    o PROFIBUS, PROFINET RT/IRT

• Power In: AC Adapter, USB, or Single cell (1S) Li-Ion/Li-Po Battery

• Power Out: 1.8V, 3.3V and SYS (Switched VIN)

• Selectable AM335x I/O Voltage: 1.8V or 3.3V

• 400 Ball BGA (27mm x 27mm)

• 20 x 20 grid, 1.27mm Pitch

• Case Temp Range: 0° to 85°C, -40° to 85°C

OSD335x-SM

LOGO_OSD335x-SM

OSD3358-SM-RED

LOGO_OSD3358-SM-RED

OSD335x

LOGO_OSD335x

OSD335x C-SiP is assigned to following product groups:

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