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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_PACKAGING SERVICES

PACKAGING SERVICES

LOGO_PACKAGING SERVICES

PACKAGING SERVICES

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Because we facilitate your design activity with foundries, we can also select, design, qualify, and produce your product’s package based on your chip-to-package co-design requirements. Our package engineers have experience in all lead frames or laminate-based surface mount packages, Smart Card modules, and in-lays and flex circuits, as well as wafer packaging and bumping options for WLCSP optimal soldering.

Our one-roof partnerships with major OSAT’s allow us to offer a large portfolio of packaging solutions at competitive cost, mid-to-large capacity, and with a high level of quality.

We maintain an internal database of more than 850 packages (standard and semi-customs) to enable us to select the best one for your project. We operate a proprietary reference/maturity management system that allows you to drive multiple combinations of silicon, software stack (ROM code, secure boot), package, personalization (OS, keys), test flows and finishing – and ultimately automatically create your own product references and catalog.

TEST SERVICES

LOGO_TEST SERVICES

PRODUCT QUALIFICATION

LOGO_PRODUCT QUALIFICATION

LAB SERVICES

LOGO_LAB SERVICES

Solutions for the Internet of Things chips

LOGO_Solutions for the Internet of Things chips

PACKAGING SERVICES is assigned to following product groups:

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