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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_Development on demand, prototyping, low volume manufacturing

Development on demand, prototyping, low volume manufacturing

LOGO_Development on demand, prototyping, low volume manufacturing

Development on demand, prototyping, low volume manufacturing

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Imec turns your concept or prototype into a manufacturable product.

Imec is your strategic partner for translating a challenging device concept or prototype into a manufacturable product, tailored to your specific needs and specifications.

To develop your tailored component, our experienced engineering teams can rely on a wide technology portfolio and extended processing capabilities, including, for example, sensors, detectors, MEMS, 3D integration, Si and SiN photonics, wafer handling and packaging, and 90nm/130nm CMOS. Imec is the only place where you can find an advanced 200mm/8-inch CMOS pilot line (which is also equipped for MEMS fabrication and 3D integration) that combines the process capabilities and quality of a foundry with the flexibility of a lab.

Imec’s dedicated development projects are bilateral, tailored to your specific needs. Our teams enable a product starting from either a concept or a prototype: we can develop a manufacturable process of a prototype you might already have, we can integrate on-chip your current product, or investigate how to tackle a specific application by using semiconductor technology.

Talk to us about high-quality design on demand, prototyping and low-volume manufacturing of:

• Dedicated ICs

• (Integrated) systems-on-chip

• High-end sensors and detectors

• Test modules

• Integrated systems for various applications (automotive, aeronautical, aerospace, medical, life sciences, …)

• Hardware development

• System integration


For dedicated product development, imec uses its 200mm CMOS pilot line, which is also equipped for MEMS fabrication and 3D integration.

It comprises:

Full CMOS compatible flow capabilities

• 180nm lines on 200mm wafers

• 193nm DUV ASML lithography available

Wafer handling and packaging

• Processing on Si, SOI, fused silica or glass

• Wafer thinning down to 20μm, grinding and CMP

• Wafer-to-wafer bonding: silicon or glass

• Chip-to-wafer bonding

• Wafer-level bonding of MEMS on CMOS substrates

• Custom post-processing on wafers from other foundries


• Broad variety of polymers for wafer-scale integration

• Low impedance, corrosion resistive electrode materials

• ALD with sub-nm thickness control, high-k dielectrics

• Electroplating of Cu, Sn, Ni

• Exotic materials introduction into CMOS environment and new material deposition development upon request

Special features

• Through-silicon wafer etch capability

• Bumping and through-silicon via integration

• Extensive in-line metrology and defect characterization, features down to 50nm

• State-of-the-art optical waveguide performance for visible light, NIR, IR

• Integrated optical filter stacks


At imec, you can find expertise in many different technology domains. This wide-ranging technology toolbox can be used to enable a chip for your application, or to tackle the challenges required to manufacture your unique device. Our technology portfolio includes:

• (Advanced) MEMS

• Si photonics

• SiN photonics:

• For processing SiN photonics components standalone or on top of a (foundry) imager

• Applications: sensors, spectroscopy, solid state lidar

• 3D integration

• Versatile platform to enable different type of device topologies

• Design and simulation

• Microfluidics

• Novel materials

• ...

Learn about some of our work here:

Development on demand, prototyping, low volume manufacturing is assigned to following product groups:


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