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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_Atlantik Elektronik presents new XBee3® ZigBee 3.0 RF modules from Digi International

Atlantik Elektronik presents new XBee3® ZigBee 3.0 RF modules from Digi International

LOGO_Atlantik Elektronik presents new XBee3® ZigBee 3.0 RF modules from Digi International

Atlantik Elektronik presents new XBee3® ZigBee 3.0 RF modules from Digi International

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Smallest programmable RF modules for short range and LPWAN applications

Atlantik Elektronik, provider of innovative embedded wireless connectivity solutions, presents XBee3® ZigBee 3.0 RF modules from Digi International, fully integrated, certified and ready to connect to wireless mesh networks.

The XBee3® modules there are three different form factors: through hole, surface mount and micro. The micro modules have approximately one-third of the size of the Digi XBee surface mount modules. The following protocols are offered: ZigBee 3.0, 802.15.4 and Digi Mesh. The Digi XBee3 platform provides the smallest smart IoT End-node to meet today’s need to acquire and process data at the end device and send only actionable data upstream in the network.

The Digi XBee3 delivers the smallest programmable module providing RF connectivity for short range and LPWAN applications, such as the areas smart city, energy, industry, metering, transportation and sensor networks. The XBee 3 requires small, efficient design, and need control logic at the endpoint to eliminate separate microcontrollers.

Digi XBee3 brings a new era of flexibility to mesh networking enabling a higher level of abstraction without worrying about the chip level design traps and efforts. The modules require little to no configuration or additional development.

Digi XBee is more than a module. In fact it's a complete ecosystem of wireless modules, gateways, adapters and software. All engineered to accelerate wireless development for global deployments.

The free and simple GUI platform XCTU includes all of the software tools you need to get up and running with Digi XBee fast. The unique graphical network view visually presents your Digi XBee network along with the signal strength of each connection. And the intuitive API frame builder helps you build and interpret API frames for Digi XBees being used in API mode. Digi XCTU is the developer’s toolkit that makes Digi XBee development easier than ever.

The release of the Digi XBee 3 allows hardware to be compatible with multiple protocols including ZigBee, Thread, 802.15.4, Digi Mesh, Wi-Fi and Bluetooth, all available on a single hardware platform. The devices are available in 3 form factors; micro, through hole and surface mount.

The Digi XBee 3 RF modules are available in 3 form factors: micro, surface mount as well as through-hole.

The Digi XBee3® ZigBee 3.0 RF modules in Micro form factor are available now at Atlantik Elektronik.

Your contact person at the Atlantik Elektronik booth 141, hall 3 in Nuremberg is Mr. Michael Demel (Business Development Manager).    

Atlantik Elektronik presents dual band 802.11ac and Bluetooth SoC from Qualcomm

LOGO_Atlantik Elektronik presents dual band 802.11ac and Bluetooth SoC from Qualcomm

Atlantik Elektronik presents the highly integrated wireless embedded IoT gateway

LOGO_Atlantik Elektronik presents the highly integrated wireless embedded IoT gateway

Atlantik Elektronik presents the Inforce Computing IFC-6640 SBC with Qualcomm Snapdragon 820 processor

LOGO_Atlantik Elektronik presents the Inforce Computing IFC-6640 SBC with Qualcomm Snapdragon 820 processor

New Wi-Fi and Bluetooth Combo Modules for the IoT in compact CF3 form factor

LOGO_New Wi-Fi and Bluetooth Combo Modules for the IoT in compact CF3 form factor

Atlantik Elektronik presents new XBee3® ZigBee 3.0 RF modules from Digi International is assigned to following product groups:

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