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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_Bluetooth Module BGM13P & BGM12x SiP

Bluetooth Module BGM13P & BGM12x SiP

LOGO_Bluetooth Module BGM13P & BGM12x SiP

Bluetooth Module BGM13P & BGM12x SiP

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Blue Gecko SiP & Standard Modules force the miniaturization in IoT

The new module series BGM12x and BGM11s from Silicon Labs offers solutions for future challenges in IoT design. Small and powerful components are absolutely necessary for the requirements of IoT. The principle of miniaturization applies precisely to wearables, ambient live products, radio signal detections and smartwatches, and this is where the new module series starts.

The System-in-Package (SiP) modules have an integrated chip antenna with exceptional RF performance (70% antenna efficiency), providing a complete, miniaturization, cost-effective connectivity solution. Just 6.5mm x 6.5mm, the enclosure measures and the PCB footprint, including the antenna space can be minimized to 51mm² - that creates space for future IoT designs. The high SiP integration of the module simplifies the development of the radio system, the protocol decision and the antenna signal. The ARM® Cortex®-M4 processor, a high-output Bluetooth power amplifier, the highly efficient onboard antenna, in combination with the reliable, secure Bluetooth 4.2 stack, and the proven development tools are available to the developers. The BGM12x and the BGM11s are already pre-certified and minimizes development costs and enables a-fast-time-to-market launch with global RF certifications.

The BGM13p - pin-compatible with the proven BGM111, also based on the EFR32BGx with double storage capacity and adapted antenna sensitivity for Bluetooth 5.0 - provides a first outlook on the continuation of the successful module series - the future promises to be "blue".

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Bluetooth Module BGM13P & BGM12x SiP is assigned to following product groups:


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