26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018

OSD335x

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The Octavo Systems OSD335x System-in-Package (SiP) device is the first device in the OSD335x Family.  It integrates the Texas Instruments Sitara ARM® Cortex®-A8 AM335x Processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, and all needed passive components into a single 27mm X 27mm BGA package.

Integrating the DDR3, power system, and passive devices into the single package removes the complexities of DDR3 to processor interfacing and power sequencing.  This allows for a vastly simplified final system design.

The 400 Ball BGA package is 40% smaller than the equivalent discrete design making it a great solution for space constrained applications.  The package also utilizes a 1.27mm (50 mil) ball pitch making it extremely easy to assemble.  The ball pitch also allows for the use of more relaxed Printed Circuit Board (PCB) design rules, saving PCB cost.

The OSD335x provides a quick and easy way to implement a system around the TI AM335x while also providing space savings, simplified supply chains, lower cost manufacturing, and greater reliability.

Features

•Integrated into a single BGA Package:

     oTexas Instruments Sitara™ AM335x ARM® Cortex®-A8 Processor

     oup to 1GB DDR3L Memory

     oTPS65217C Power Management IC

     oTL5209 LDO

     oPassives

•TI AM335x Features:

     oup to 1GHz

     o8 Channel 12-bit SAR ADC

     oEthernet 10/100/1000 x2

     oUSD 2.0 HS OTG + PHY x2

     oMMC, SD and SDIO x3

     oLCD Controller

     oSGX 3D Graphics Engine

     oPRU Subsystem

•Access to all AM335x Peripherals

     oCAN, SPI, UART, I2C, GPIO, etc.

•Power In: AC Adapter, USB, or Single cell (1S) Li-Ion/Li-Po Battery

•Power Out: 1.8V, 3.3V and SYS (Switched VIN)

•AM335x I/O Voltage: 3.3V

•400 Ball BGA (27mm x 27mm)

•20 x 20 grid, 1.27mm Pitch

•Case Temp Range: 0° to 85°C, -40° to 85     

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