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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_OSD335x-SM

OSD335x-SM

LOGO_OSD335x-SM

OSD335x-SM

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The OSD335x-SM is the smallest Texas Instruments Sitara based module. At a size of only 21mm X 21mm it is 60% smaller than a discrete implementation.  This System-In-Package (SiP) device integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor running up to 1GHz, DDR3 memory, TPS65217C PMIC, TL5209LDO, all the needed passives, and 4KB of EEPROM into a single BGA package.  This integration removes the tedious tasks of DDR3 routing and Power Sequencing, allowing designer to focus on the parts of their system that truly add value.

The OSD335x-SM utilizes a wide 1.27mm (50mil) pitch BGA.  This combined with a new optimized Pin Map allows designers to escape all the BGA signals in a single layer.  The wide pitch also simplifies the assemble process and removes common concerns associated with manufacturing BGAs.

The OSD335x-SM also gives designers the ability to tailor the device to meet their needs.  The I/O Voltage Domains and the ADC Ranges are both programmable.  The PMIC low power modes are also made accessible as well as the PMIC voltage monitors giving the ability to more finely tune the power performance of the final design.

This all enables designers to create smaller, full featured, cost effective Embedded Linux systems faster.  The OSD335x-SM is the perfect solution for those looking for the most flexible ARM-based solution in the smallest footprint.

Features:

•Integrated into a single BGA Package:

     oTexas Instruments Sitara™ AM335x ARM® Cortex®-A8 Processor

     oup to 1GB DDR3L Memory

     oTPS65217C Power Management IC

     oTL5209 LDO

     o4KB EEPROM

     oPassives

•TI AM335x Features:

     oup to 1GHz

     o8 Channel 12-bit SAR ADC

     oEthernet 10/100/1000 x2

     oUSD 2.0 HS OTG + PHY x2

     oMMC, SD and SDIO x3

     oLCD Controller

     oSGX 3D Graphics Engine

     oPRU Subsystem

•Access to all AM335x Peripherals

     oCAN, SPI, UART, I2C, GPIO, etc.

•Power In: AC Adapter, USB, or Single cell (1S) Li-Ion/Li-Po Battery

•Power Out: 1.8V, 3.3V and SYS (Switched VIN)

•Selectable AM335x I/O Voltage: 1.8V or 3.3V

•256 Ball BGA (21mm x 21mm)

•16 x 16 grid, 1.27mm Pitch

•Case Temp Range: 0° to 85°C, -40° to 85°C

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