26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_Schroff small form factor solutions

Schroff small form factor solutions

LOGO_Schroff small form factor solutions

Schroff small form factor solutions

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Pentair, a global leader in protecting critical processes, people and the environment, has developed a new concept which enables design engineers to quickly create customized solutions to house and protect their small form factor boards, while minimizing development costs and lead time. Using a modular approach design, engineers can specify their enclosure, cooling, peripheral components, and mounting method based on the needs of their specific application. Each building block can easily be configured and combined, resulting in a customized solution ready for manufacture.

The design starts with Pentair’s innovative Schroff Interscale enclosure, which features integrated EMC protection, requires only two screws for assembly, and has flexible height, width, and depth dimensions.  For customers working with Industrial PC board standards such as MiniITX, ATX, embeddedNUC and others, the cut-outs have been prepopulated in the design to save time.

The cooling module includes options for conduction and convection cooling. FHCs (flexible heat conductors) provide industry leading conduction cooling performance and design engineers have options for heat sink height and orientation. For convection cooling, one and two fan configurations are available, with a variety of fan location and perforation options. Compatible components including industrial grade power supplies, power switches and indicators, and hard disk drive brackets are available. The enclosure can be completed with wall/desk brackets, DIN rail clips, tip up or rubber feet.

For those customers interested in Computer on Module (COM), Pentair also offers a complete Embedded COM system including the COM module and the carrier board. This concept is also modular: For example, a wide range of fieldbus connections can be implemented using a pluggable add-on module. Using the XMC slot, FPGA mezzanines or processor modules can be connected to the COM module via the carrier or a custom circuit can be established on the prototype module. The power module is also designed as a pluggable module, making it easy to adapt to different line voltages and power outputs. For integrated system solutions the Pentair project management group supports customers directly.

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Schroff Interscale case platform for Industrial IoT applications

LOGO_Schroff Interscale case platform for Industrial IoT applications

Schroff ServCite: More performance for network function virtualization

LOGO_Schroff ServCite: More performance for network function virtualization

Easily configure front panels and generate 3D drawings

LOGO_Easily configure front panels and generate 3D drawings

Modular COM carrier for COM Express type 6 modules

LOGO_Modular COM carrier for COM Express type 6 modules

Schroff small form factor solutions is assigned to following product groups:

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