3D PLUS is enabling higher integration along high reliability while offering a wide range of DDR3 modules in various density and bus width. for example, the 3D3D16G32WB2650 is a high speed stack multi-chip package integrated 8Gbits x2 DDR3 SDRAM and fabricated with ultra-high performance CMOS process containing 16Gbits which is organized as 64Mbits x 8 banks by 32 bits.
The 3D3D16G72WB2487 is a highly integrated module operating as a DDR3 SDRAM 72b SO-DIMM in a BGA package. It is intended for use as main memory when installed in embedded systems.
3D PLUS is working on the next generation in order to answer to your needs.