26 - 28 February 2019 // Nuremberg, Germany
Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and embedded products. To better meet the requirement of many space-constrained wearable and IoT applications, Kingston has released the world’s smallest eMMC package with standard JEDEC footprint. The technology specifications of eMMC are managed by JEDEC, the global leader in developing open standards for the microelectronics industry.
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Small Package eMMC is assigned to following product groups:
