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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_Small Package eMMC

Small Package eMMC

LOGO_Small Package eMMC

Small Package eMMC

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Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and embedded products. To better meet the requirement of many space-constrained wearable and IoT applications, Kingston has released the world’s smallest eMMC package with standard JEDEC footprint. The technology specifications of eMMC are managed by JEDEC, the global leader in developing open standards for the microelectronics industry.

eMMC

LOGO_eMMC

I-Temp eMMC

LOGO_I-Temp eMMC

Embedded DRAM - DDR3/3L

LOGO_Embedded DRAM - DDR3/3L

Multi-Chip Packages

LOGO_Multi-Chip Packages

Small Package eMMC is assigned to following product groups:

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