DRAM (Dynamic Random Access Memory) by high-capacity and low price, have found wide application in a variety of industrial equipment. Currently, there are four generations of DRAMs with different characteristics:
SDRAM - high ease of implementation, mainly used in embedded devices
DDR1 - double the transfer rate
DDR2 - double the transfer speed, low voltage power supply
DDR3 - advanced interface with built-in termination data and address bus
Memory configurations are available for operation in the temperature range of the primary C to +85 C and extended - 40C to +95 C (105 C), as well as in a wide variety of configurations as: Non-ECC, ECC, Non-Registered, Registered, DIMM , SODIMM.