• Fanless 1.2GHz VIA Eden® X4 processor
• Compact 13.8cm x 7.2cm Pico-ITXe form factor
• Dual Gigabit Ethernet support
• MXM connector for Smart I/O Expander
• DirectX® 11 graphics with MPEG-2, WMV9, VC1, and H.264 decoding acceleration
VIA EPIA-E900 Pico-ITXe Board
The VIA EPIA-E900 Pico-ITXe board brings the flexibility of the modular approach to single-board design, creating the most versatile platform for building a diverse range of ultra-small form factor devices for in-vehicle, industrial automation and a myriad of other vertical market applications. With the inclusion of a high-speed MXM connector interface, customers can quickly design custom Smart I/O expansion cards for their specific applications saving both cost and time-to-market.
The VIA EPIA-E900 integrates the advanced performance of the 1.2GHz VIA Eden® X4 processor with the superior multimedia capabilities of the VIA VX11H media system processor on a highly compact Pico-ITXe form factor measuring just 13.8 cm x 7.2 cm.
The highly-integrated low power platform features a rich set of I/O and connectivity options, including two USB 3.0 ports, two USB 2.0 ports, two Gigabit Ethernet ports, one Mini HDMI port, 2 COM ports, and one MXM connector for the addition of custom smart I/O expansion cards.
The VIA EPIA-E900 is compatible with Windows® 10, Windows® 8.1, Windows® 8, Windows® 7, and WES 7, as well as most popular Linux distributions. A wide range of software development tools are also available, including the VIA Smart ETK.
In addition to its onboard pin headers as well as the optional VIA EMIO-1533 USB Wi-Fi module, customers can leverage the MXM connector to quickly expand functionality to match their unique I/O requirements with the creation of a custom Smart I/O expansion card.
The MXM interface supports one SATA, four USB 2.0 ports, one DisplayPort or HDMI port, one single channel 18/24-bit LVDS panel connector, one DVP port, HD Audio, one COM port, one PCIe x 4 slot, one Digital I/O (3GPI + 3GPO), one SMBus, and 1 SPI.