14 - 16 March 2017 // Nuremberg, Germany

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Zoom product LOGO_VIA QSM-8Q60 Qseven™ Module

VIA QSM-8Q60 Qseven™ Module

LOGO_VIA QSM-8Q60 Qseven™ Module

VIA QSM-8Q60 Qseven™ Module

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• Ultra compact 70mm x 70mm Qseven™ (2.0) form factor

• 1.0GHz Freescale™ i.MX 6DualLite Cortex-A9 SoC

• Wide operating temperature range from -20°C ~ 70°C

• 7 year longevity support

• Evaluation carrier board available

The VIA QSM-8Q60 is an ARM-based Qseven™ form factor module powered by a 1.0GHz Freescale™ i.MX 6DualLite Cortex-A9 SoC that delivers high performance and rich multimedia features in an ultra-compact package for a wide range of embedded system applications such as industrial automation, transportation, medical and infotainment.

Hardware

The VIA QSM-8Q60 measures 70mm x 70mm and is fully compliant with the Qseven™ Rev. 2.0 embedded form factor standard adopted by the Standardization Group for Embedded Technologies e.V. (SGeT). Supporting a wide operating temperature of -20°C ~70°C, the VIA QSM-8Q60 is designed for optimum flexibility in the harshest environments.

Featuring an on-board Micro SD card slot, 4GB eMMC Flash memory and 2GB DDR3-10666 SDRAM, the module also offers rich I/O and display expansion options including 4 USB 2.0 ports, one HDMI port, one dual-channel 18/24-bit LVDS panel, 3 COM ports, Gigabit Ethernet, 2 CAN bus and PCIe x1.

Software

The VIA QSM-8Q60 features a Linux BSP which includes the kernel (3.10.53) and bootloader source codes. Other features include a Tool Chain to help make adjustments to the kernel and to support the VIA QSMBD2 carrier board I/O and other hardware features.

A full set of software customization services that speed up time to market and minimize development costs are also available.

Expandability

Customers can take advantage of our multi-I/O evaluation carrier board or can utilize VIA’s extensive technical support in developing a custom baseboard.

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VIA QSM-8Q60 Qseven™ Module is assigned to following product groups:

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