14 - 16 March 2017 // Nuremberg, Germany

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Zoom product LOGO_Board to Board Adapters Pitch 0.5mm to 1.27mm

Board to Board Adapters Pitch 0.5mm to 1.27mm

LOGO_Board to Board Adapters Pitch 0.5mm to 1.27mm

Board to Board Adapters Pitch 0.5mm to 1.27mm

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Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patent pending female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.

BGA Burn-In Sockets

LOGO_BGA Burn-In Sockel

GHz Sockets for Memory Chips

LOGO_GHz Sockel für Memory Chips

HF Probe Adapter with SMA Connector

LOGO_HF Test Adapter mit SMA Anschluss

Silver Ball Matrix Sockets

LOGO_Silver Ball Matrix Sockel

Board to Board Adapters Pitch 0.5mm to 1.27mm is assigned to following product groups:

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