14 - 16 March 2017 // Nuremberg, Germany

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Zoom product LOGO_Sensor Systems for Automatic Doors

Sensor Systems for Automatic Doors

LOGO_Sensor Systems for Automatic Doors

Sensor Systems for Automatic Doors

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- unpackaged silicon chips bonded into a cavity

- Chip on board – module with optical coating

- Assembly of the modules onto semi-flex printed circuit board

- Soldering using a low temperature process

DigitalSTROM® Application

LOGO_DigitalSTROM®-Applikation

LED Technology

LOGO_LED-Technologie

Molding of Components

LOGO_ Verguss von Baugruppen

Radio Modules

LOGO_Funkmodule

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