14 - 16 March 2017 // Nuremberg, Germany

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MIRO-3-3I847CW-3517UE DIN-rail fanless embedded system for fanless DIN-Rail / Panel Mounting, Intel CPU i7-3517UE 1.7GHz with up to 8GB DDR3 RAM

The modern dual core Intel i7-3517UE with 1.7GHz CPU allows the MIRO-3-3I847CW-3517UE DIN-rail fanless embedded system using high capacity RAM memory up to 8GB DDR3, but still makes a fanless DIN-Rail/Panel Mounting in a wide temperature range from -10 ° C to + 60 ° Celsius possible.

Inside, the compact housing of MIRO-3-3I847CW-3517UE DIN rail Fanless Embedded System extensionslots are offering customization for Mini Card or Mini PCI Express and for mSATA SSD with variable capacity. The Intel CPU 1.7GHz i7-3517UE has a very low TDP of only 17 watts to achieve maximum performance at minimum heat ejection. DIN rail or panel-mounted installation is easily and comfortably done in confined spaces. The combination of a powerful processor with DDR3 RAM up to 8GB allows the graphic intensive and capacity consuming processes with a direct integration of sensors and plant equipment via serial port RS232, USB or IP/TCP. For this purpose, the MIRO-3-3I847CW-3517UE DIN-rail fanless embedded system provides 10/100/1000 Mbit/s dual LAN high bandwidth for physical separation of the networks or redundant connection. Best practice options are in addition to modern, intelligent systems such as the Smart Factory industry 4.0 the support of older process chains that are enabled through a hardware upgrade to a significantly higher performance.





NISE 3700E




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