The LPKF ProtoLaser S4 debuted a few weeks ago at productronica 2015. The final series product will be presented at embedded world. It features an attractive design and impressive functionality.
In laser PCB processing, the laser beam cuts the copper layer by evaporating the copper along the cutting channel. LPKF has developed a second processing mode for large-area ablation in which the copper layer is first cut into fine strips and then removed. The different absorption values of the substrate and the copper layer ensure that the underlying substrate is not damaged to any significant extent.
The actual innovation in the ProtoLaser S4 lies in the use of a laser wavelength of 532 nm, which lies in the visible green light range. LPKF thereby expands the process window because the absorption rates for the copper layer and the substrate differ greatly here. The ProtoLaser S4 can thus compensate for minor inhomogeneities in copper thickness caused by galvanic through-hole plating. Structures are produced with no residues and no damage to the structure.
The ProtoLaser S4 is also capable of cutting, scoring, and drilling organic layers on PCBs. Precise processing of flexible substrates is also possible thanks to the ProtoLaser S4’s vacuum table and vision system.
The ProtoLaser S4 is the LPKF lab laser specialist for PCB processing and will be available in January 2016.