14 - 16 March 2017 // Nuremberg, Germany

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Zoom product LOGO_Thermal management for PCBs

Thermal management for PCBs

LOGO_Thermal management for PCBs

Thermal management for PCBs

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Thermal management for circuit boards

Würth Elektronik has developed a clever heat management concept that uses constructive procedures to dissipate heat directly on the circuit board level. This is an economic way of protecting high-performance components against excess temperatures and it ensures flawless functioning and high durability.

Heatsink technology highlights - an overview:

  • Heatsink applications offer optimized heat management
  • Thin circuit board for good heat conduction and high cycle stability
  • Combination of vertical and horizontal cooling
  • Vertical cooling through thermovias or microvia/buried via combination
  • Horizontal cooling through heat spreading in copper layers and/or heatsink
  • Low thermal resistance
  • Various thicknesses possible
  • Customized forms possible
  • Photosensitive solder stop, various final surfaces possible
  • Suitable for wire bonds

HDI Microvia Technology

LOGO_HDI Microvia Technologie

Rigid-flex PCBs

LOGO_Starrflex Leiterplatten

Thermal management for PCBs is assigned to following product groups:

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