14 - 16 March 2017 // Nuremberg, Germany

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Zoom product LOGO_HDI Microvia Technology

HDI Microvia Technology

LOGO_HDI Microvia Technology

HDI Microvia Technology

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Microvia HDI PCBs

Why Microvia Technology?

HDI (high density interconnection) circuit boards and Microvia Technology are inextricably linked. Microvias are minute holes drilled by a laser to generate the electrical connection between the layers in a multilayer circuit board.

Via in Pad microvias play a decisive role in the miniaturisation of circuit boards. “Via in Pad“ means that microvia holes are located directly in the solder pads. As microvias are not blind holes no capillary forces arise. The solder deposit fills the minimum hollow space

This technology offers many advantages:

• Option of component layout with the smallest BGA pitch  

• Miniaturisation with ‘Via in Pad’ technology  

• Cost-effective generation of high wiring density  

• Future-proof technology – components are becoming smaller all the time  

• High reliability  

• Reduction in inductance and capacitance effects  

Rigid-flex PCBs

LOGO_Starrflex Leiterplatten

Thermal management for PCBs

LOGO_Wärmemanagement für Leiterplatten

HDI Microvia Technology is assigned to following product groups:

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