TechNexion’s PICO System-on-Modules are Ubiquitous computing, very compact, high performance SoM’s that are highly optimized for mobile Internet of Things applications using a pin-compatible scalable platform that not only utilize the “Edison” connector connectivity for sensors and low-speed I/O but also adds additional expansion possibilities for multimedia and connectivity. With dimensions at only 40x36mm it not just come in very tiny but also allows you to shrink your design to the next level.
Additionally the “DWARF” platform eases proto-typing and accelerate time to market by offering a complete platform introducing a large number of ready to use sensors and available I/O’s to take advantage of todays’ technology and communication challenges, giving our customers’ cutting edge technology that can easily be expanded and implemented into Industry 4.0 applications.
DWARF stands for:
Drones: Compact and lightweight.
Wearables: Low power, small and easily expandable.
Appliances: Multimedia options and control I/O.
Robotics: Camera and sensors. Battery powered.
Fun: Opensource software....enough said.
TechNexion PICO Modules incorporate only components from embedded roadmaps of strategic suppliers and are backed up with value added technical services such as life cycle management, revision control and end-of-life support.
TechNexion and Open Source
TechNexion PICO modules come standard with source code and binary demo images for the following Operating Systems.
-Android binary demo images, instructions to make your own as well as complete source code available.
-Linux binary demo images and full source code u-boot, kernel and support packages available.
-yocto binary demo images and full source code u-boot, kernel and support packages available.
-ubuntu binary demo images available.
Custom Carrier board Design
Customers can design their own carrier board using the freely available schematic design files and leverage on the available software source code that comes standard with every PICO Module and therefore bringing a custom designed solution to market using a very short design cycle and reduced engineering risks. TechNexion offers custom tailored carrier board design and manufacturing services where our expertise will assist you to ensure your design is fully compatible and future upgrade proof while moving to next generation PICO modules.
Kickstart your project development cycle with our plug and play development startkits that come pre-loaded with working software and all tools to assist you to validate performance and explore additional possibilities without the need to invest a huge amount of time and resources upfront.
Find more information on TechNexion website:
At the moment the PICO is available with ARM (RISC) chips from Freescale mainly i.MX6 (IMX6)