Samtec Z-Ray™ is an array of embedded contacts used as interposers for board stacking, IC-to-board, and cable-to-board applications.
These micro array interposers are ultra-high density, low profile, highly customizable solutions for complex IC-to-board applications. Z-Ray™ incorporates spring temper BeCu (Beryllium Copper) micro-formed contacts that are assembled into rugged low profile FR4 substrates under high pressure and temperature.
Z-Ray™ is tested to 2,500 cycles and is available with an elastomeric overlay for contact protection. The .012” contact deflection allows greater board tolerances. The 30 grams normal force per contact is nearly 40% less than other micro contacts, requiring less hardware and stiffeners.
In testing now, Z-Ray™ contacts are expected to achieve up to 40 Gbps.
Standard products include the ZA8 Series, a 0,80 mm pitch grid which allows up to 1,024 contacts per square inch and the ZA1 Series, with contacts on a 1,00 mm grid, allows up to 625 contacts per square inch.
Both Series allow 1,00 mm stacking.
Z-Ray™ interposers are highly customizable, with pitches to 0,65mm pitch. Custom stack heights range from 0,50mm to 7,00mm.
Customer-specific pin counts are available for high density and speed flexibility, as well as customer-specific stack heights, pin counts, insulator shapes, plating thicknesses, alignment and screw options, dual compression, and single compression contacts with solder balls.
To learn more about Z-Ray™ go to http://www.samtec.com/connectors/high-speed-board-to-board/high-density-arrays/interposers.aspxor e-mail us at zRay@samtec.com.