Avnet Silica ist der europäische Halbleiterspezialist von Avnet Inc., einem der führenden globalen Distributoren, der eine intelligente Verbindung zwischen Kunden und Zulieferern schafft. Das Unternehmen sorgt für weniger komplexe Abläufe, da kreative Lösungen, Technologie und Logistiksupport bereitgestellt werden. Avnet Silica ist seit vielen Jahren ein Partner führender Halbleiterhersteller und innovativer Lösungsanbieter. Mit einem Team von mehr als 200 Applikationsingenieuren und technischen Spezialisten unterstützt Avnet Silica Projekte von der Idee über das Konzept bis hin zur Produktion.
Von unserer Servicequalität – technisch und logistisch – sind über 15.000 Kunden europaweit überzeugt. Nicht zuletzt weil sich die Applikationsingenieure auf lösungsorientierte Design-in-Beratung und technischen Produktsupport konzentrieren. Als Zusatzleistungen bieten wir außerdem an: Programmierservice, Gurtungsverfahren, Prototyping, Dry Packaging & Baking, Laser Marking sowie Supply Chain Lösungen.
Powerhouse is a ready-to-install module which addresses the rapidly growing segment of the energy measurement market that is being driven by the requirement to have real-time information about the
electricity usage of household products, building automation devices, data centers servers and factory automation to name a few. The module is based on the highly accurate energy measurement device from Cirrus Logic and the proven Power Line Communication technology from Echelon. Due to the high integration of the measurement, control and communication functions the module comes in a very small form factor which even fits in a wall plug. To set up an installation in a home for example, just connect the modules to the powerline and the system is ready to report energy consumption or switch on and off the power of each single metering point. This easy binding is achieved with the Interoperable Self-Installation (ISI) from Echelon. With the ISI protocol, devices can self-install automatically or at the push of a button.
Avnet Memec has developed an end to end reference platform for energy monitoring. The building blocks include our Powerhouse Module directly monitoring usage and providing a local communications path over the power line. The smart server together with a GSM modem provides a gateway to the internet. A web page served by the gateway can be accessed by any web browser on a PC or smart device. For true M2M connectivity a managed cellular network is accessed through the Porthos management platform which provides the reliability and control required for industrial applications.
Marvell's MW300 Wi-Fi microcontroller is the industry's first true single-chip SoC with 802.11n Wi-Fi and full-featured microcontroller. Thecomplementing EZ-Connect Software™ enables easy provisioning. The MW300 Wi-Fi microcontroller features the following key benefits:
• Low-power optimizations enabling deep low-power states and reduced power-consumption in active modes to enable battery-powered applications
• Very low RBOM requiring only a single crystal, QSPI flash, and antenna with a single input power rail
• Easy interfacing to sensors, actuators, and other components via a full set of I/O interfaces including SPI, I2C, UART, I2S, PWM, ADC, DAC reducing extra components and PCB footprint
• Enable audio and video streaming in any IoT device via a powerful Cortex-M4F CPU with DSP and Floating point support, large SRAM, and high-speed USB 2.0 OTG interface supporting USB Video (UVC) and Audio (UAC)
MAXM17504: 4.5V-60V, 3.5A High-Efficiency, DC/DC Step-Down Power Module with Integrated Inductor
The Himalaya series of voltage regulator ICs and Power Modules enable cooler, smaller and simpler power supply solutions. The MAXM17504 is an easy-to-use, step-down power module that combines a switching power supply controller, dual n-channel MOSFET power switches, fully-shielded inductor, and the compensation components in a low-profile, thermally-efficient, system-in-package (SiP). The device operates over a wide input voltage range of 4.5V to 60V and delivers up to 3.5A continuous output current with excellent line and load regulation over an output voltage range of 0.9V to 12V. The device only requires five external components to complete the total power solution. The high level of integration significantly reduces design complexity, manufacturing risks, and offers a true plug-and-play power supply solution, reducing time-to-market.
The device can be operated in the pulse-width modulation (PWM), pulse-frequency modulation (PFM), or discontinuous conduction mode (DCM) control schemes.
The MAXM17504 is available in a low-profile, highly thermal- emissive, compact, 29-pin 9mm x 15mm x 2.8mm SiP package that reduces power dissipation in the package and enhances efficiency. The package is easily soldered onto a printed circuit board and suitable for automated circuit board assembly. The device can operate over the industrial temperature range from -40°C to +125°C.
Reduces Design Complexity, Manufacturing Risks, and Time-to-Market
Integrated Switching Power Supply Controller and Dual-MOSFET Power Switches
Integrated Compensation Components
Integrated Thermal-Fault Protection
Integrated Peak Current Limit
Saves Board Space in Space-Constrained Applications
Complete Integrated Step-Down Power Supply in a Single Package
Small Profile 9mm x 15mm x 2.8mm SiP Package
Simplified PCB Design with Minimal External BOM Components
Offers Flexibility for Power-Design Optimization
Wide Input Voltage Range from 4.5V to 60V
Output-Voltage Adjustable Range from 0.9V to 12V
Adjustable Frequency with External Frequency Synchronization (100kHz to 1.8MHz)
Microsemi’s next-generation SmartFusion2 SoC FPGAs are the only devices that address fundamental requirements for advanced security, high reliability and low power in critical industrial, military, aviation, communications and medical applications. SmartFusion2 integrates an inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM® Cortex™-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM, and industry-required high-performance communication interfaces all on a single chip.
SmartFusion2 SoC FPGA is a mix of hard IP blocks and FPGA on a single die. By leveraging hard IP within the device we can maximize the functional resources common to many systems in minimal silicon space, while offering full flexibility for design customization with the FPGA fabric and firmware. The Microcontroller Subsystem (MSS) has multiple interfaces to the FPGA, to allow for peripheral expansion and algorithm acceleration in the fabric. By using a flash process we can include embedded nonvolatile memory for data and code storage, and have significant advantages in design and data security.
SmartFusion2 integrates for the first time non volatile flash based FPGA with a full feature Microcontroller subsystem, enhanced FPGA fabric and high speed serial and memory interfaces. The FPGA fabric composed of 4-input LUT logic elements, includes embedded memories and mathblocks for DSP processing capabilities. The Microcontroller subsystem adds the Embedded Trace Macrocell, instruction cache and includes USB, CAN and gigabit Ethernet. High speed serial interfaces with up to 4 SERDES lanes supports PCIe, XAUI and Native SERDES interfaces and up to two high speed DDR memory interfaces are included supporting LPDDR, DDR2 and DDR3.
166MHz ARM® Cortex™-M3 w/ on chip eSRAM & eNVM
Includes ETM and Instruction Cache
Extensive peripherals CAN, TSE, USB
Most Secure FPGA
DPA Hardened, AES256, SHA256, Random Number Generator
Most Reliable FPGA
SEU Immune Zero FIT Flash FPGA Configuration Cells
SEU Protected Memories: eSRAMs, DDR Bridges (MSS, MDDR, FDDR), Instruction Cache, Ethernet, CAN and USB Buffers, PCIe, MMUARTand SPI FIFOs
Hard 800 mbps DDR2/3 controllers with SECDED (also called EDAC) protection