Konferenzen und Rahmenprogramm
Blending DSP and ML Features Into a Low Power General Purpose Processor – How Far Can We Go?
With increasing signal processing requirements in various types of embedded systems, we have seen a number of new chips on the market that combine both a digital signal processor (DSP) and a general purpose processor to address the processing demands. While this suits high-performance devices where silicon area and power are less of a concern, such devices could be difficult to program and can have limitations. To address the challenge, Arm has been working on technologies that boost the signal processing and machine learning capabilities for future embedded processors. In this presentation, we will look at how Arm Helium technology compares to features found on traditional DSPs, and some of the fundamental differences between VLIW (Very Long Instruction Word) architecture and the Helium approach to the processor's pipeline design. We will also look into how the processing requirements affect the processor's level-one memory system design and system design considerations.
--- Datum: 26.02.2020 Uhrzeit: 16:30 - 17:00 Uhr Ort: Conference Counter NCC Ost