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Assembly Design Kit Construction Using RF-Blocks in Package Technologies
The design effort for upcoming integrated circuit and package technologies is rising because of increasing complexity in production. To cope with that situation it is essential to reuse pre-qualified elements for handle complexity. For package technologies this becomes more and more apparent. Looking at the requirements for 5G applications for package technologies it is no longer feasible to start from scratch. So it becomes more and more import to use prequalified elements for a technology and build your general system based on a construction kit of radio-frequency blocks. This paper deals with the implementation of RF-structures for manufacturing and characterization and establishing of a set of elements, that are pre-qualified and are available as building blocks to be used for future projects. For upcoming package technologies it is getting more and more important to include these devices into so called Assembly Design Kits (ADK) to enable designs by potential customers.
--- Datum: 25.02.2020 Uhrzeit: 12:00 - 12:30 Uhr Ort: Conference Counter NCC Ost