Tagesübersicht - 26-02-2020

Keynote Session 1: Display Trends & Technologies

Opening of the electronic displays Conference 2020

Zombie markets

OLED Market and Technology Development

Product Innovation and Technology Development with Flexible AMOLEDs

How Automotive Applications Drive Display Innovations

Escape from Overcapacity: What Next for the Display Industry?

DooH goes outdoor

Session 01: Touch Technologies

Designing UltraTouch force-sensing touch screen panels

Touch 2.0 - The next Level of HMI

Integration of Touch and Display in Embedded Linux

Development of Novel LOCA for Automotive Curved Displays

Large PeDOT Touch Sensors and A New Method for Comparing Touch Performance in Different Materials

Session 02: (Automotive) Interface Technologies

Realizing remote display systems for safety applications

Video Compression: A Vital Requirement for Next-Generation Vehicles

SerDes Interfaces for Automotive Displays

1, 2, 3, 4 – USB is offering more

Internal Display Interfaces in the System Context

Session 03: Display Technologies & Applications

Low cost, conformable Organic LCDs on plastic and their applications

Non-flammable Displays

Reflective Electro-Wetting Displays For Out Of Home Display Applications

HoloScreen - Opportunities and Challenges of Tracked Autostereoscopic 3D Display Technology

Why Liquid Crystal Windows?

Session 04: (Automotive) GUI/HMI

Smart Surfaces - HMI technologies for the cockpit of the future

3D HMI for Automotive Center Console

GUI Trends – Building UX for the Future

IoT Dashboards – from data flow to data-driven decisions

Session 05: Head-Up Displays

Paving the way to augmented reality – 3D HUDs

Challenges for AR microdisplays in outdoor applications

Head Up – Eyes Out

How in-glass laminated displays improve vehicle safety, ergonomics and UX

Session 06: Display Glass & Measurements

Laser cutting technology for free-form and 3D-shaped displays & cover glasses

Eliminating sparkle on high pixel density displays using anti-glare Albatross glass

Understanding and Achieving Reproducible Sparkle Measurements for an Automotive Specification

Optical In-line Metrology Systems for Displays

CLASS 3.2 Embedded Android Workshop

Embedded Android Workshop

CLASS 6.2 The Bruce Douglass Class 2: Advanced Behavioral Modeling in UML and SysML

The Bruce Douglass Class 2: Advanced Behavioral Modeling in UML and SysML

CLASS 6.3 The Greg Davis Class: Advanced C/C++ Coding and Debugging Techniques

The Greg Davis Class: Advanced C/C++ Coding and Debugging Techniques

CLASS 6.4 Safe Modern C++

Safe Modern C++

CLASS 10.1 Integrating Arm CortexM soft CPU IP into FPGAs

Integrating Arm Cortex-M Soft CPU IP into FPGAs

SESSION 1.2 Internet of Things II - Platforms

IoT Edge Development Frameworks/Platforms – Spoilt for Choice

Ultra-small PLCs Enable Intelligence at the Edge

How to Rapidly Develop IoT Devices with Arm and AWS

Extending EdgeX Foundry – How to Build an IoT Solution from an Open Source, Platform Independent Framework

Building IoTopia – GlobalPlatform's Initiative to Standardize Security for IoT Devices & Services

IoT Communication Implementation Strategies for Industrial Automation Devices

SESSION 1.3 Internet of Things III - Data Management, Edge, Fog, Cloud

Cybersecurity Clouds Over the Bright Future of Smart Grids

Staying Smart: Open Source's Role in Smart City Evolution

Condition Monitoring and Embedding CANopen in IoT

Leverage the Security and Resiliency of the Cloud and IoT for Industrial Use Cases

Real Predictive Maintenance in Three Practical Steps

Bridging the Gap Between Cloud Computing and Edge Devices

SESSION 2.2 Connectivity II - TSN

Bluetooth Mesh Networking – A Practical Guide for Embedded Developers

SESSION 2.3 I Connectivity III - Bluetooth I

Design Considerations for Bluetooth Mesh Across Industrial and Home Environments

Combining Bluetooth Mesh and KNX: The Best of Both Worlds

Understanding Bluetooth Range

Designing for Ultra-Low-Power Bluetooth Communication

Bluetooth Security – A Technical Overview & Implementation Guide for Embedded Developers

SESSION 2.3 II Connectivity IV - Bluetooth II

New Ways of Testing of Bluetooth LE from R&D to Production

Previewing the Next Generation of Bluetooth Audio

Wireless Auto-addressing for Vehicle Modules Using Bluetooth Localization Techniques

Bluetooth Location Services and High Accuracy Direction Finding

Bluetooth Indoor Direction Finding Brings a New Dimension to Indoor Asset Tracking

SESSION 3.2 I Embedded OS III - Linux I

The Robert Berger Presentation: The Yocto Project – A bird's Eye View

Debian or Yocto? Which is the Best for your Embedded Linux Project?

Embedded Software Development CI/CD on Ubuntu

Why TSN won't Work without Real-time Linux

Linux Kernel Debugging: Going Beyond Printk Messages

Safety Certification and Open Source - Can They Work Together?

SESSION 3.2 II Embedded OS IV - Linux II

Deploying and Running Containers on Embedded Devices with FullMetalUpdate

Advantages of Heterogeneous SoCs in IoT Applications

Panfrost: Open Source Meets Arm Mali GPUs

Using Cgroups in Container Technology for a Fine Grain Control of System Resources

How Did Automotive Grade Linux Become THE Open Source Community Cars?

A Clean Slate Approach to Embedded Linux Security: RISC-V Enclaves

SESSION 4.3 I Functional Safety & Security III - Hardware Security I

Benefits of an Integrated Secure Element for IoT Applications

Improving IoT Security from Root to Cloud – PSA Certified at 1 Year

Secure Flash – The Cure for Insecurity in Connected Automotive and Industrial Applications

Securing the Bluetooth Low Energy (BLE) Physical Layer with Round Trip Time of Flight Measurements

Evaluation of Public Key Certificate Enrolment in Resource Constraint Embedded Field Devices

Virtual Platform Based Development Environments for Low Power, Mixed Level Safety Critical Systems

SESSION 4.3 II Functional Safety & Security IV - Hardware Security II

Security is Not Free: Understanding the Hidden Costs of Securing Connected Devices

Application of TPM2.0 in industrial and Automotive Systems Using the Feature API of the Open Source Software Stack

Challenges of Delivering and Protecting Third-party Firmware Libraries on Microcontroller Systems

Out of the Box: Addressing Security with the MCU Based Amazon Voice Services Solution

Analysis of Firmware Protection in State-of-the-Art Microcontrollers

Improved FPGA-security by Partial Reconfiguration

SESSION 5.2 Hardware II - Power & Data

Enabling IoT Growth with Energy Harvesting Wireless Sensor Technology

Powering Sigfox Nodes with Harvested Energy

Analysis, Design and Optimization of a Combined wireless Power Transfer and Near Field Communication System

Powering the 5G Revolution with Power over Ethernet

MEMs Based Wired Condition Monitoring Solution for Industry 4.0

CAN, LIN, RS232/485 Over DC Powerline – Challenges and Semiconductor Solutions

SESSION 5.3 Hardware III - Power Supply

USB Type-C, A New Power Paradigm

Microcontroller Supplies Made Easy

Beyond the Data Sheet: Calculating Battery Life for Wireless IoT Devices

Wireless Power Systems up to 15 Watt – Test and Comparison

Overcoming "Dirty-Power" Challenges Through Suitable Protection Schemes

Surviving Automotive Power Transients

SESSION 6.3 I SW-Engineering III - Development Process I

Engineering Smart Ecosystems: Challenges and Solutions

How Agile is Changing the Face of Embedded Software Development

Efficient Implementation of A-SPICE in Non-Automotive Company

How to Write Good Functional & Safety Requirements in 2020?

Bridging the Gap Between Requirements, Architecture and Implementation

Requirements Traceability: Different Things to Different People

SESSION 6.3 II SW-Engineering III - Development Process II

Why Semantic Analysis Can Reduce the Burden of Requirements Quality Reviews

Safe Critical Application Development for Multicore Platform with ANSYS SCADE

Safety- and Security-critical Embedded Software Development Within DevOps

Guidelines, Tips and Tricks for Managing Open Source Software for Embedded Systems

A Hierarchical State Machine (HFSM) Realization with Polymorhism and Inheritance

Dynamic Memory Allocation & Fragmentation in C & C++

SESSION 6.4 I SW-Engineering IV - Testing & Debugging I

Actionable Ideas for Improving Software Quality

Self-testing in Embedded Systems

Fully Automated Self-test and Calibration for Hardware in the Loop Test Systems

Practical Software Testing Techniques and Guidelines for Embedded Systems

Conclusive On-the-fly Validation of High-Level Functional Tests

Test the Test – Enhanced Test Quality with Mutation Testing

SESSION 6.4 II SW-Engineering V - Testing & Debugging II

Non-intrusive Software Coverage Estimation for Safety-Critical System Certification

Can Free Tools Test the Security of a Small Embedded System?

Using Advanced Code Analysis for Boosting Unit Test Creation

Debugging Complex Failures of Real-Time Multi-Core Systems

Leveraging an Agnostic Approach to Debugging in Multicore Environments

Usage of Debugger in Hardware in the Loop Tests

SESSION 8.3 I Intelligent Systems III - AI & ML Technologies I

Machine Learning Building Blocks for Industrial Applications

Accelerating ML Compute for IoT/Embedded Market

Deep Learning Inference on the MPPA3 Manycore Processor

Neural Network Optimizations for On-Device AI

A Visit to the Neuromorphic Zoo

Getting AI in Your Pocket with Deep Compression

SESSION 8.3 II Intelligent Systems IV - AI & ML Technologies II

Architecture Apocalypse: Dream Architecture for Deep Learning Inference and Compute -VERSAL AI Core

Designing Machine Learning Solutions for AI Based Embedded Systems

Low-bit CNN Implementation and Optimization on FPGA

From Data to Insight – with End to End AI Solutions

AI on Microcontrollers

SESSION 10.4 I SoC IV - System Technology I

IP Authoring for Re-Usability in SoC-based Designs and Derivative Products

Safety and Security Considerations for SoC Development

Adding Differentiating Value, Reduce Implementation Time €“ A Fast Track for Integration of New Protocols/Standards

Framework to Port Neural Networks to FPGA, Suitable for Realtime Signal Processing

FPGA-based Modelling of Aging Effects and Implementation of IP-Cores for Wear-Out-Detection

An FPGA-based Neural Network Accelerator for Computational Storage Platforms

SESSION 10.4 II SoC V - System Technology II

From Design to Runtime: A Practical Approach to Reconfiguration

RISC-V Hardware and Software Technology for Industry

An Enclave-based TEE for SE-in-SoC in RISC-V Industry

Emerging SoC Performance/Power Challenges and a Dozen Techniques

Blending DSP and ML Features Into a Low Power General Purpose Processor – How Far Can We Go?

Improving Interface Adoption and Advancement with Programmable Devices

Expertenrunden

Embedded Vision Everywhere!?

Connecting Embedded Intelligence

Vorträge Ausstellerforum

Data When and Where You Need It: How RTI Connext DDS Creates a Future-Proof Architecture for Autonomous Systems

Must or shall? And the question about: Can flying planes be dangerous?

Beneficial use of Bode Plots on SIGLENT Oscilloscopes

Building Bridges To The Cloud: Apacer’s Double-barreled Solution...

Automated Debugging and Testing with Universal Debug Engine (UDE)

How to maximise PCB space with connector selection

Data science applications for factory environment: Hygiene control, Location tracking and behavior analysis cases

Integration of security into embedded systems: 10 pitfalls, challenges, mistakes and problems

Introducing the World’s first RISC-V based MCU – GD32VF103x

The OSADL Open Source Policy – the best way for license compliance

IoT-Kits auf dem Prüfstand – Dichtung und Wahrheit

How design tools such as Flex Power Designer can speed up design cycles and time to market for Power Supply designers

Scalability, up, down and right – a distributed micro-kernel for Automotive, Robotics and IoT

New jitter separation method for debugging high-speed interfaces with the R&S®RTP oscilloscope.

Bring your robot application from idea to industrialization with AAEON UP Squared and AWS Robomaker

IoT in smart lighting. Hybrid platform solution. // MEMS for IoT: transfer ideas into solutions

Open Source ecosystem für OPC UA Pub Sub over TSN

embedded world Start-up Presentation

Start-up Presentation

Embedded-Standards

SDT.05 – Standard für Auflötmodule

Single Pair Ethernet – einfach nur weniger Kabel?

COM-HPC – das neue Top-End für Module

Serving Embedded Requirements using Supply Chain Expertise

Halbleiter/RISC-V

Batterien laden im Auto – von 10 Wh bis 60 kWh

Fehlertolerante und robuste Recheneinheiten

Das ist neu bei RISC-V

Industrielle Kommunikation 5G/TSN

Industrial 5G – Möglichkeiten und Grenzen

5G-Campus-Netze – verdrängen sie drahtgebundene Industrienetze?

MQTT – zu Unrecht im Schatten von OPC UA?

Supply Chain

Podiumsdiskussion: Distribution & Supply Chain – fit fürs neue Jahrzehnt?

Messtechnik

Abschied aus der Branche nach 30 Jahren

Disruptiver Designprozess: In 12 Wochen zum HiL-Testsystem

Marketing

Podiumsdiskussion: Marketing im Embedded-Markt

Stromversorgung

Podiumsdiskussion: Wie finde ich die passende Stromversorgung für mein Embedded-System?

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Tagesübersicht Mittwoch 26. Februar 2020

electronic displays Conference

ewC // Embedded OS

ewC // Software & Systems Engineering

ewC // System-on-Chip (SoC) Design & Development

ewC // Internet of Things - Platforms & Applications

ewC // Connected Systems

ewC // Safety & Security