Diese Website verwendet Cookies, um das Angebot nutzerfreundlicher und effektiver zu machen. Mit der Nutzung dieser Website stimmen Sie der Verwendung von Cookies zu.Weitere Informationen über die Verwendung von Cookies und die Möglichkeit der Verwendung von Cookies zu widersprechen, finden Sie hier.
The OSD335x-SM is the smallest Texas Instruments Sitara based module. At a size of only 21mm X 21mm it is 60% smaller than a discrete implementation. This System-In-Package (SiP) device integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor running up to 1GHz, DDR3 memory, TPS65217C PMIC, TL5209LDO, all the needed passives, and 4KB of EEPROM into a single BGA package. This integration removes the tedious tasks of DDR3 routing and Power Sequencing, allowing designer to focus on the parts of their system that truly add value.
The OSD335x-SM utilizes a wide 1.27mm (50mil) pitch BGA. This combined with a new optimized Pin Map allows designers to escape all the BGA signals in a single layer. The wide pitch also simplifies the assemble process and removes common concerns associated with manufacturing BGAs.
The OSD335x-SM also gives designers the ability to tailor the device to meet their needs. The I/O Voltage Domains and the ADC Ranges are both programmable. The PMIC low power modes are also made accessible as well as the PMIC voltage monitors giving the ability to more finely tune the power performance of the final design.
This all enables designers to create smaller, full featured, cost effective Embedded Linux systems faster. The OSD335x-SM is the perfect solution for those looking for the most flexible ARM-based solution in the smallest footprint.
Octavo Systems is a leading provider of System-In-Package (SiP) solutions. Octavo provides a standard offering incorporating Texas Instruments based ARM Cortex-A processors, making it easy for electronics designers to innovate and build small, cost effective embedded Linux systems.
At Octavo we leverage SiP technology to integrate over 100 individual components, including power management and high speed memory into a single IC package. This integration means designers no longer have to spend time on tedious tasks that add little value to their system. Instead they can spend more time on the phases that will truly different the product and get it to market faster. Octavo Systems’ mission is to bring these capabilities to the masses.
Integration through System-In-Package can also simplify your supply chain, reduce manufacturing costs, and increase the system's reliability.
We look forward to seeing you at the show. If you would like to set up a time to meet, please contact us at http://octavosystems.com/contact/