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he OSD335x Complete System-in-Package (C-SiP™) integrates everything that is needed to build an embedded processing system into a single package. It includes the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, 4KB of EEPROM, Embedded Multimedia Card (eMMC) non-volatile storage, a MEMS Oscillator, and all the needed passives into a single BGA package. At 27mm X 27mm, it is almost 50% smaller than an equivalent system made of discrete components.
The OSD335x C-SiP™ significantly reduces the effort required to design an embedded system. Don’t worry about DDR, Power Sequencing, Flash, or Oscillators, just connect power and your peripherals to the OSD335x C-SiP. That’s It.
The OSD335x C-SiP also simplifies your sourcing and supply chain. Over 100 components are integrated into one meaning you don’t have to find sources for DDR, eMMC, or capacitors. We take care of that for you.
The OSD335x C-SiP is the perfect solution for the designer that is looking for the fastest way to complete their ARM Cortex®-A based system.
• Integrated into a single BGA Package:
o Texas Instruments Sitara™ AM335x ARM® Cortex®-A8 Processor
o up to 1GB DDR3L Memory
o TPS65217C Power Management IC
o TL5209 LDO
o 4KB EEPROM
o Up to 16GB eMMC Non-Volatile Storage
o Low Power, Low Jitter MEMS Oscillator
• TI AM335x Features:
o up to 1GHz
o 8 Channel 12-bit SAR ADC
o Ethernet 10/100/1000 x2
o USB 2.0 HS OTG + PHY x2
o MMC, SD and SDIO x3
o LCD Controller
o SGX 3D Graphics Engine
o PRU Subsystem
• Access to all AM335x Peripherals
o CAN, SPI, UART, I2C, GPIO, etc.
• Support for Industrial Protocols
o EtherNet/IP, SERCOS III
o PROFIBUS, PROFINET RT/IRT
• Power In: AC Adapter, USB, or Single cell (1S) Li-Ion/Li-Po Battery
• Power Out: 1.8V, 3.3V and SYS (Switched VIN)
• Selectable AM335x I/O Voltage: 1.8V or 3.3V
• 400 Ball BGA (27mm x 27mm)
• 20 x 20 grid, 1.27mm Pitch
• Case Temp Range: 0° to 85°C, -40° to 85°C
Leider gibt es für diesen Aussteller kein deutsches Firmenprofil.
Octavo Systems is a leading provider of System-In-Package (SiP) solutions. Octavo provides a standard offering incorporating Texas Instruments based ARM Cortex-A processors, making it easy for electronics designers to innovate and build small, cost effective embedded Linux systems.
At Octavo we leverage SiP technology to integrate over 100 individual components, including power management and high speed memory into a single IC package. This integration means designers no longer have to spend time on tedious tasks that add little value to their system. Instead they can spend more time on the phases that will truly different the product and get it to market faster. Octavo Systems’ mission is to bring these capabilities to the masses.
Integration through System-In-Package can also simplify your supply chain, reduce manufacturing costs, and increase the system's reliability.
We look forward to seeing you at the show. If you would like to set up a time to meet, please contact us at http://octavosystems.com/contact/