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Smaller, thinner, lighter, faster, more layers, greater interconnection density. All of these PCB attributes force the adoption of thin core dielectrics. When once 50u was considered to be thin ( eg: 1 human hair is 80u ) now the use and handling of 25u and even 12u dielectric cores is becoming commonplace. Add to that the compounding challenge of finer trace widths and reduced annular rings and the task gets a whole lot tougher.
Ultrathin materials are not managed by conventional PCB Fabrication techniques or equipment. Ultrathin materials have unique characteristics and particularly their “physical characteristics” present the greatest challenge during PCB fabrication.
At EES-PCB we are routinely handling 12u dielectric cores and VLP and HVLP Cu foils. Our handling systems, conveyor systems and equipment has been enhanced to accommodate these cores, to protect thin cores and to do so at competitive yields.