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Because we facilitate your design activity with foundries, we can also select, design, qualify, and produce your product’s package based on your chip-to-package co-design requirements. Our package engineers have experience in all lead frames or laminate-based surface mount packages, Smart Card modules, and in-lays and flex circuits, as well as wafer packaging and bumping options for WLCSP optimal soldering.
Our one-roof partnerships with major OSAT’s allow us to offer a large portfolio of packaging solutions at competitive cost, mid-to-large capacity, and with a high level of quality.
We maintain an internal database of more than 850 packages (standard and semi-customs) to enable us to select the best one for your project. We operate a proprietary reference/maturity management system that allows you to drive multiple combinations of silicon, software stack (ROM code, secure boot), package, personalization (OS, keys), test flows and finishing – and ultimately automatically create your own product references and catalog.
Leider gibt es für diesen Aussteller kein deutsches Firmenprofil.
Presto Engineering Inc. provides secure semiconductor operations to IoT companies that need low-risk productization, accelerated time-to-market and fast volume scaling. Serving companies from small start-ups to large corporations, Presto provides comprehensive outsourced production from tape-out to delivery of finished goods from small to high volume production runs. Its proprietary, highly-secure (EAL5+/6) provisioning solutions can be tailored to customers’ needs. The company has a long history of security success and supports 6 facilities that are home to more than 100 experts in the US, Europe and Asia. For more information, visit: www.presto-eng.com.