Optimised for Android platforms, the FT311D USB Host IC demonstrates FTDI Chip's commitment to the progression of the Android Open Accessories(AOA) initiative.
This new USB Full Speed (12Mbit/s) host IC is specifically targetted at providing Android platforms such as tablet PCs or smartphones with interconnectivity to end product systems using USB technology.
Leading brand Google unveiled the initative which uses industry standard USB technology with an additional enumeration step. As a result, the USB connection allows the Android platform to function as a USB slave or peripheral. This eliminates the need to source power, store class drivers, and support the USB host stack, which has responsibility for controlling the USB bus. In the end, the USB host functions are now relegated to the end product which is connecting to the Android platform.
FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineeers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip. The unique, streamlined approach utilised by these ICs allow dramatic reductions in the development time and bill-of-materials costs involved in next generation Human Machine Interface (HMI) implementation. FTDI Chip also provides families of highly-differentiated, speed-optimised microcontroller units (MCUs) with augmented connectivity features, specifically designed with compatibility to its USB and Display product lines in mind. These MCUs are targeted for key applications where they can add value with their superior processing performance and high levels of operational efficiency.
FTDI Chip is a fab-less semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and techical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).