The FT313H is an enhanced general purpose USB2.0 Hi-Speed USB Host controller designed for integration with microcontrollers via parallel bus options and offering battery charger emulation on the downstream port to support higher charging currents.
Key Hardware Features include:
USB 2.0 Hi-Speed Host, EHCI compatible, single port IC
Supports multiple bus interfaces, 8-bit or 16-bit bus for GPIO, SRAM or NOR Flash
Supports Bulk, Isochronous, Control and Interrupt transfers
Split transaction support for external USB hubs
Single power supply operation at 3.3V
1.8V, 2.5V and 3.3V IO levels supported
24kB high speed RAM memory
Battery Charger Emulation (BCD 1.2) to allow downstream devices to request higher currents
Extended operating temperature range: -40°C to 85°C
Available in Pb-free QFN-64, LQFP-64 and TQFP-64 packages (RoHS compliant).
Connect memory sticks for high performance data transfers
Set top box file playback
Digital photo frames
Industrial system analysis
Enable connection of a communication class device for system expansion and connectivity
Hosting RFID readers
Hosting Wi-Fi dongles
Hosting Zigbee dongles
Establishing high speed data link between end-equipment subsystems.
Visit us at Embedded World 2014, Stand 4A-328 or visit our website, www.ftdichip.com for more information.
Leider gibt es für diesen Aussteller kein deutsches Firmenprofil.
FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineeers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip. The unique, streamlined approach utilised by these ICs allow dramatic reductions in the development time and bill-of-materials costs involved in next generation Human Machine Interface (HMI) implementation. FTDI Chip also provides families of highly-differentiated, speed-optimised microcontroller units (MCUs) with augmented connectivity features, specifically designed with compatibility to its USB and Display product lines in mind. These MCUs are targeted for key applications where they can add value with their superior processing performance and high levels of operational efficiency.
FTDI Chip is a fab-less semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and techical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).