Frore Systems

Frore Systems is the developer of breakthrough thermal technology for electronic and consumer devices. The company’s active cooling solutions, the AirJet®Mini, AirJet®Mini Slim, AirJet®Mini Sport, and AirJet®PAKs, are integrated into devices to remove heat silently, resulting in major performance gains and enabling thinner, lighter, silent, vibration free, dustproof and waterproof devices. Frore Systems is headquartered in San Jose, CA.

The AirJet PAK, is the world’s first solid-state active cooling solution designed to complement a wide range of System on Module (SoM) AI Computers, including NVIDIA’s Jetson Orin Nano, Nano Super, NX & Orin AGX modules, as well as SoMs from Qualcomm, NXP, AMD/Xilinx, and more. The

AirJet PAK can be directly mounted on the SoM, removing heat and unleashing the full Edge AI performance.

AirJet PAKs are available in a range of sizes designed for easy integration into EDGE AI platforms of varying performance requirements.

* AirJet®PAK 5C-25: contains 5 AirJet chips, measures just 100x65x9.8mm, removes up to 25 Watts of heat, and supports up to 100 TOPS.

* AirJet®PAK 3C-15: contains 3 AirJet chips, measures just 100x65x5.8mm, removes up to 15 Watts of heat, and supports up to 40 TOPS.

* AirJet®PAK 1C-5: contains 1 AirJet chip, measures just 30x65x5mm, removes up to 5 Watts of heat, and supports up to 10 TOPS.

Like all AirJet products, the AirJet PAK is easily scalable, multiple AirJet PAKs can be combined when higher levels of processor performance and heat dissipation is needed. For example, 2 AirJet®PAK 5C-25 can be used to remove up to 50 Watts of heat supporting up to 200 TOPS.