man

Firma:

Intel Corporation

Boon Leong Ong

Intel Corporation

Ong Boon Leong works for Intel Corporation under IoT Group in Malaysia. He has built and led several teams in developing Yocto Project BSP layers for intel product lines (from Xeon-class to Atom-class) which covers technologies such as DPDK, QAT, boot-loader, secure boot & etc. In addition, he is technical lead that oversees the enablement of technologies such as Ethernet, TSN and Sensor Framework. He is an active speaker in Yocto Project Summit and intel Software Professional Conferences. From time to time, he provides adjunct lectures to academia and STEM organization. He is passionate in bridging the gap of FOSS projects adoption by internal product team and local academia. He presented in EmbeddedWorld 2017 on 'Rapid and Efficient Methodology to convert Android into Linux-based IOT OS: A case study on Intel SoFIA', EmbeddedWorld 2018 on 'Demystifying Time Aware Traffic Shaping Technologies for TSN: A case study for Linux driver enabling', 2018 IEEE 802.1 SA Ethernet @ IP Automotive Technology Day on 'A comparative analysis of Precision Time Protocol in native, virtual machines and container-based environments for consolidating time sensitive automotive workloads'.