Press Releases

26.02.2013

“The embedded AWARD is presented every year to outstanding development achievements, smart minds and real enthusiasts, who contribute to the sustained development of the embedded systems industry. The winners with their solutions can boost growth in many segments. They help to strengthen and develop our community’s leading position as the engine of the world economy in the long term. The award rewards the best results from our embedded experts and in this way illustrates the enormous performance and dynamic of our industry to the outside world. I heartily congratulate all the winners,” says a delighted Prof. Dr.-Ing. Matthias Sturm, HTWK Leipzig, Chairman of the embedded world Exhibition Committee and the jury.

The “Internet of Things”, in which autonomous embedded systems independently supply each other with information and interoperate, is increasingly taking shape and will enable smart and innovative future solutions on which researchers and developers are already working today. This year’s awards focus completely on this field and show the way ahead for the whole industry.

The winner in the Software category is:

• ARM: ARM/Vodafone mbed IoT Rapid Prototyping Platform

What previously only worked over mobile phones can now be done by embedded systems too – Internet communication over mobile networks. And all this without human intervention. This makes large-scale networks possible, e.g. for ecological monitoring. The developers have presented and disclosed their solution, which is based on a Vodafone stick. This invitation to re-use and continue development will certainly generate new product ideas and lead to further progress for the “Internet of Things”.

The winner in the Hardware category is:

• Enpirion: EL7001 Power IC family

Enpirion developed the first 2-dimensional thin-film magnetic cores with new wafer-level magnetic technology and also provides an initial product with its EL7001 Power IC family.
Enpirion has developed an iron-copper magnetic alloy with which tiny passive magnetic components can be manufactured and applied to ICs. This means it is now possible for the first time to apply magnetic components to CMOS substrates with standard wafer processes.

The convincing winner in the Tools category is:

• iSystem AG: iC6000 Blue Box

The error-free performance of embedded systems is a basic requirement for their acceptance. Finding and clearing errors to provide long-term support for software developers is the declared aim of iSystem. With its
iC6000 Blue Box, iSystem supplies a first-class debugging tool that enables users to check their own applications and quickly clear errors. The tool also makes software tests possible without instrumenting the user code, i.e. on the real product. iSystem claims this is unique.

This year’s Special Award goes to the Fraunhofer Institute for Integrated Circuits (IIS):

• Maintenance-free and energy-autarkic wireless multi-hop sensor network

Measuring, controlling and monitoring is of great importance in virtually all processes nowadays. Fraunhofer IIS supplies a pioneering solution with its maintenance-free, energy-autarkic and wireless sensor network. It provides an independent radio network in which sensors can connect and disconnect automatically.

“I am delighted that the Fraunhofer Institute for Integrated Circuits has won this year’s Special Award and sincerely congratulate the institute,” says
Dr. Roland Fleck, Managing Director of NürnbergMesse. “Fraunhofer IIS is one of the most important drivers of outstanding scientific work, innovations and know-how here in the metropolitan region and far beyond. embedded world and Fraunhofer IIS together have guaranteed high technology for many years and make a great contribution to the success of the embedded community. With the AWARD for this development, we pay tribute to the innovative power and vision of the scientists and inventors,” Dr. Fleck adds.

The jury members in 2013 were again recognized experts:

• Prof. Dr. Steve Furber, University of Manchester
• Prof. Dr.-Ing. Albert Heuberger, Executive Director, Fraunhofer Institute for Integrated Circuits
• Dr. Erich Biermann, Senior Vice President Engineering, Automotive Electronics, Robert Bosch GmbH
• Prof. Dr.-Ing. Matthias Sturm, Leipzig University of Applied Sciences and Chairman of the embedded world Exhibition Committee

All exhibitors and their current product information can be found at:
www.ask-embedded-world.de